Principal RF/EM Engineer

About the role

As a Principal RF/EM Engineer at Nokia, you will be at the forefront of designing innovative broadband circuits and systems that shape the future of telecommunications. Collaborating within a dynamic, multidisciplinary design team, you will tackle complex challenges in electromagnetic modeling, RF structures, and high-speed ASIC packaging. Your leadership in developing and validating state-of-the-art designs will drive the development of next-generation products. The work environment is collaborative and fast-paced, filled with passionate professionals committed to pushing technological boundaries. You will thrive in a culture that encourages continuous learning, creativity, and teamwork while delivering cutting-edge solutions that redefine network performance. Join us to make a meaningful impact in shaping the future of connectivity!

Responsibilities

• Lead the design and development of advanced broadband circuits and ASIC packaging solutions.
• Conduct electromagnetic modeling and validation of RF structures and IC package transitions.
• Perform end-to-end channel simulations and eye diagram analysis to ensure optimal performance.
• Guide a multidisciplinary team in creating and verifying proof of concepts and evaluation boards.
• Oversee substrate selection and detailed modeling of PCB, modules, and interconnects for high-speed applications.
• Develop high-speed test fixtures and calibration kits; execute comprehensive design verification up to 90GHz.
• Implement continuous improvements in signal integrity and modeling techniques to enhance modeling accuracy.
• Collaborate with cross-functional teams to publish test reports and provide actionable recommendations.

Qualifications

You have:

• M.Sc./Ph.D. in Electrical Engineering with a focus on microwave design
• Minimum of 5 years of experience in HFSS modeling and ADS
• Expertise in designing passive structures above 50GHz
• Proficient in measurements using VNAs and probing techniques

It would be nice if you also had:

• Experience in Telecom product development
• Familiarity with PCB, HDBU, and mSAP fabrication techniques
• Knowledge of Electro-optics and RF test equipment
• Proficiency in MATLAB and other simulation tools